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Alternative Plating Processes - List of Manufacturers, Suppliers, Companies and Products

Alternative Plating Processes Product List

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Electroless Ni-P replacement Au plating process with excellent solder wettability.

Electroless Ni-P replacement Au plating process with excellent solder wettability.

For printed circuit boards. An alternative to the electroless Ni-P/replacement Au plating process is possible.

The 'Electroless Ni-P/Replacement Au plating process with excellent solder wettability' is a plating process that uses 4Ag, which has similar characteristics to Au, making it an alternative to the electroless Ni-P/Replacement Au plating process. The solder wettability is better immediately after plating compared to the electroless Ni-P/Replacement Au plating. For more details, please contact us or download the catalog.

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Electroless Ni-P/Replacement Au plating process with excellent corrosion resistance alternative plating process.

Electroless Ni-P/Replacement Au plating process with excellent corrosion resistance alternative plating process.

For printed circuit boards. An alternative plating process with excellent corrosion resistance using electroless Ni-P/replaceable Au plating.

The electroless Ni-P/replacement Au plating alternative plating process forms a dense and corrosion-resistant Pd film between the electroless Ni-P plating and the replacement Au plating, resulting in excellent corrosion resistance. Although a Pd film is formed as an intermediate layer, the solder wettability immediately after plating is almost equivalent to that of electroless Ni-P/replacement Au plating. For more details, please download the catalog or contact us.

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Electrolytic Ni/Electrolytic Au plating with excellent corrosion resistance alternative plating process.

Electrolytic Ni/Electrolytic Au plating with excellent corrosion resistance alternative plating process.

On printed circuit boards. A Pd coating with excellent corrosion resistance is formed, providing outstanding corrosion resistance.

The 'Electrolytic Ni/Electrolytic Au Plating Alternative Plating Process' forms a dense and corrosion-resistant Pd film between the electrolytic Ni plating and the electrolytic Au plating, resulting in excellent corrosion resistance. The solder wettability immediately after plating is almost equivalent to that of electrolytic Ni/electrolytic Au plating. For more details, please contact us or download the catalog.

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